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A tech company with a military background, Cryolophos, has made waves in the cooling industry. Affiliated with Loma, it previously introduced a heat-dissipation technology that improved efficiency by 30 times. Now, GE, a U.S.-based giant, has announced a breakthrough—its new cooling solution is as thin as a credit card and could power the next generation of ultra-thin devices like flat panels and notebooks.
This innovative radiator is called DCJ, short for Dual Piezoelectric Cooling Jets. Think of it as a micro-flow bellows that pushes high-speed air into electronic components. Compared to traditional convection cooling, DCJ produces ten times more turbulent airflow, significantly boosting the heat exchange rate.
Peter de Bock, an electronics thermal engineer at GE Global Research Center, said, “The DCJ cooling technology, originally developed for aero engines and turbine generators, drastically reduces pressure loss and load characteristics. Over the past 18 months, we've been fine-tuning acoustics, vibration, and power consumption. The optimized DCJ can eventually become the best heat dissipation solution for ultra-thin electronics.â€
Compared to current heat sinks, DCJ radiators are just 4mm thick—a 50% reduction—and consume half the power of fan-based solutions. Plus, its simple design makes it more reliable and easier to maintain than traditional cooling systems.
GE is now offering DCJ development kits to OEMs to help them integrate this technology into future products. Additionally, GE has licensed DCJ technology to Fujikura, a leading thermal solution provider, which is already using it across industries such as television, automation, automotive, and consumer electronics.
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